A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding
Name
43626577-MIT.pdf
Description
Full printable version
Size
11.51 MB
Format
Adobe PDF
Checksum (MD5)
7a407bb290e0bd25652c1a3a090a0a91
Author(s)
Yung, Chi-Fan, 1973-
Advisor(s)
Martin A. Schmidt.
Date Issued
1999
Publisher
Massachusetts Institute of Technology
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.
Includes bibliographical references (p. 89-90).
Subjects
Electrical Engineering and Computer Science.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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copyright. They may be viewed from this source for any purpose, but
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