Copper Electrodeposition Kinetics Measured by Alternating Current Voltammetry and the Role of Ferrous Species
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Allanore_Copper Electrodeposition.pdf
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Author(s)
Wagner, Mary-Elizabeth
Valenzuela, Rodrigo
Colet-Lagrille, Melanie
Allanore, Antoine
Vargas, Tomas
Wagner, Mary Elizabeth
Date Issued
November 2015
Journal
Journal of The Electrochemical Society
Publisher
Electrochemical Society
Citation
Wagner, Mary-Elizabeth, Rodrigo Valenzuela, Tomas Vargas, Melanie Colet-Lagrille, and Antoine Allanore. “Copper Electrodeposition Kinetics Measured by Alternating Current Voltammetry and the Role of Ferrous Species.” J. Electrochem. Soc. 163, no. 2 (November 5, 2015): D17–D23.
Version
Final published version
Abstract
Impurities and additives play a key role in copper electrodeposition, in particular in upstream processes such as electrowinning or electrorefining. One common impurity is iron, mostly present as iron species Fe(II) in highly concentrated sulfuric acid solutions and in a cathodic environment. Herein, the kinetics of copper electrodeposition from such solutions have been investigated using a copper rotating disk electrode and alternating current voltammetry (ACV). For a concentration of proton of 1.84 M and a concentration of Fe(II) ions of 0.054 M, the deposition kinetics are slow enough to separately observe the two electron transfer steps involved in copper reduction: an observation unique to ACV. The results suggest that Fe(II) ions affect the electrodeposition kinetic by slowing down reaction kinetics, in particular slowing the second electron transfer reaction.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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Creative Commons Attribution 4.0 International License
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DOI of Published Version
https://doi.org/10.1149/2.0121602jes
