Heat transfer via dropwise condensation on hydrophobic microstructured surfaces
Name
558876151-MIT.pdf
Description
Full printable version
Size
4.53 MB
Format
Adobe PDF
Checksum (MD5)
c5669527e775411af3535b58c0aac58d
Author(s)
Ruleman, Karlen E. (Karlen Elizabeth)
Advisor(s)
Evelyn N. Wang.
Date Issued
2009
Publisher
Massachusetts Institute of Technology
Abstract
Dropwise condensation has the potential to greatly increase heat transfer rates. Heat transfer coefficients by dropwise condensation and film condensation on microstructured silicon chips were compared. Heat transfer coefficients are found to be seventy percent higher in the hydrophobic, dropwise condensation case relative to the hydrophilic, film condensation case. With this increased heat transfer coefficient, dropwise condensation using microstructures could improve many heat exchange applications, particularly electronics cooling.
Description
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 22).
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
Persistent DSpace Link
