Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits
Name
42620931-MIT.pdf
Description
Full printable version
Size
5.72 MB
Format
Adobe PDF
Checksum (MD5)
2104a9b417a9a53c773d5c930ffa61b9
Author(s)
Srikar, V. T. (Vengallatore Thattai), 1972-
Advisor(s)
Carl V. Thompson.
Date Issued
1999
Publisher
Massachusetts Institute of Technology
Description
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1999.
Includes bibliographical references (leaves 103-108).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
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