Thermal control of electronics: Perspectives and prospects
Name
HANNEMANN.pdf
Description
Main article
Size
209.4 KB
Format
Adobe PDF
Checksum (MD5)
b3a50bc17b45117fd203d186a30d2a9a
Author(s)
Hannemann, R.J.
Date Issued
May 2003
Abstract
One of the most prominent industrial applications of heat
transfer science and engineering has been electronics thermal
control. Driven by the relentless increase in spatial density of
microelectronic devices, integrated circuit chip powers have
risen by a factor of 100 over the past twenty years, with a
somewhat smaller increase in heat flux. The traditional
approaches using natural convection and forced-air cooling are
becoming less viable as power levels increase. This paper
provides a high-level overview of the thermal management
problem from the perspective of a practitioner, as well as
speculation on the prospects for electronics thermal engineering
in years to come.
Persistent DSpace Link
