Progress in Developing and Extending RM³ Heterogeneous Integration Technologies
Name
AMMNS025.pdf
Size
1.19 MB
Format
Adobe PDF
Checksum (MD5)
270d4af4b97da8bad1ebedefce1807c9
Author(s)
Fonstad, Clifton G. Jr.
Atmaca, Eralp
Giziewicz, Wojciech
Perkins, James
Rumpler, Joseph
Date Issued
January 2003
Series/Report no.
Advanced Materials for Micro- and Nano-Systems (AMMNS);
Abstract
This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounting with monolithic metallization) technologies for heterogeneous integration. Particular emphasis is placed on the APB (aligned pillar bonding) and MASA (magnetically assisted statistical assembly) technologies. Next, ongoing research on applications of RM3 integration to produce optoelectronic integrated circuits (OEICs) for optical clock distribution, diffuse optical tomography, and smart pixel arrays are described. Finally, potential new applications of these technologies in intra- and interchip optical signal interconnects, in fluorescent dye detection and imaging for biomedical applications, and in III-V mini-IC integration on Si-CMOS for enhancing off-chip drive capabilities are outlined.
Subjects
optoelectronic integration
heterogeneous integration
self assembly
III-V heterostructures
photodiodes
VCSELs
LEDs
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