Electroactive hydrodynamic weirs for microparticle manipulation and patterning
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Voldman_Electroactive hydrodynamic.pdf
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Author(s)
Taff, Brian M.
Desai, Salil P.
Voldman, Joel
Date Issued
February 2009
Journal
Applied Physical Letters
Publisher
American Institute of Physics
Citation
Taff, Brian M., Salil P. Desai, and Joel Voldman. “Electroactive hydrodynamic weirs for microparticle manipulation and patterning.” Applied Physics Letters 94.8 (2009): 084102-3. © 2009 American Institute of Physics.
Version
Final published version
Abstract
We present a platform for parallelized manipulations of individual polarizable micron-scale particles (i.e., microparticles) that combines negative dielectrophoretic forcing with the passive capture of hydrodynamic weir-based trapping. Our work enables manipulations using ejection- and/or exclusion-based methods. In ejection operations, we unload targeted weirs by displacing microparticles from their capture faces via electrode activation. In exclusion-based operations, we prevent weir loading by activating selected on-chip electrodes before introducing microparticles into the system. Our work describes the device’s passive loading dynamics and demonstrates enhanced functionalities by forming a variety of particle patterns.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1063/1.3085955
