Solution for a modular die-level anodic bonder
Name
57570258-MIT.pdf
Description
Full printable version
Size
1.41 MB
Format
Adobe PDF
Checksum (MD5)
9d403a56f8fb8a74d598e9e740dcfab9
Author(s)
Khan, Christopher Joseph, 1982-
Advisor(s)
Alexander H. Slocum.
Date Issued
2004
Publisher
Massachusetts Institute of Technology
Abstract
Anodic bonding is a common way to package silicon with Pyrex. The anodic bonding process requires high temperature, voltage, and moderate pressure to occur. Often, there are also expectations of alignment of features for things such as power or material delivery. The following thesis proposes a design for a die-level anodic bonding apparatus. It consists of a separate module to meet each requirement; a module for heating, aligning, and applying force. The apparatus is capable of heating the MEMS device to over 400⁰C, applying more than 1000V across the device, applying greater than 4MPa of pressure, and aligning to within 0.5[micro]m in two directions to create an accurately aligned anodic bond. The apparatus met all of these functional requirements and is modular. enough to easily be configured for many other die-level anodic bonding situations.
Description
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.
Includes bibliographical references.
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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