Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes
Name
Design and modeling of membrane-based evaporative cooling devices for thermal management of high heat fluxes.pdf
Description
Main article
Size
1.36 MB
Format
Adobe PDF
Checksum (MD5)
b9f4ca82e960fd80205a568edeebece6
Author(s)
Salamon, Todd R.
Narayanan, Shankar
Simon, Maria E.
Lu, Zhengmao
Bagnall, Kevin R.
Hanks, Daniel Frank
Antao, Dion Savio
Barabadi, Banafsheh
Sircar, Jay
Wang, Evelyn
Date Issued
July 2016
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Lu, Zhengmao, Todd R. Salamon, Shankar Narayanan, Kevin R. Bagnall, Daniel F. Hanks, Dion S. Antao, Banafsheh Barabadi, Jay Sircar, Maria E. Simon, and Evelyn N. Wang. “Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes.” IEEE Transactions on Components, Packaging and Manufacturing Technology 6, 7 (July 2016): 1056–1065 © 2016 Institute of Electrical and Electronics Engineers (IEEE)
Version
Author's final manuscript
Abstract
We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid flow in the device were modeled to determine the effect of different geometric parameters. With the optimization of various parameters, the device can achieve a heat transfer coefficient in excess of 0.05 kW/cm²-K, while dissipating a heat flux of 1 kW/cm². When applied to power electronics, such as GaN high-electron-mobility transistors, this membrane-based evaporative cooling device can lower the near-junction temperature by more than 40 K compared with contemporary single-phase microchannel coolers.
MIT Department
Lincoln Laboratory
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/TCPMT.2016.2576998
