Particle generation in a chemical vapor deposition/plasma-enhanced chemical vapor deposition interlayer dielectric tool
Name
47264889-MIT.pdf
Description
Full printable version
Size
5.4 MB
Format
Adobe PDF
Checksum (MD5)
7b6ab5dc806aec74ea6bbfc8149c1182
Author(s)
Haberer, Elaine D. (Elaine Denise), 1975-
Advisor(s)
L.C. Kimerling.
Date Issued
1998
Publisher
Massachusetts Institute of Technology
Abstract
The interlayer dielectric plays an important role in multilevel integration. Material choice, processing, and contamination greatly impact the performance of the layer. In this study, particle generation, deposition, and adhesion mechanisms are reviewed. In particular, four important sources of interlayer dielectric particle contamination were investigated: the cleanroom environment, improper wafer handling, the backside of the wafer, and microarcing during process.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
Includes bibliographical references (p. 77-79).
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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