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  5. Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

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Author(s)
Guzek, John S. (John Stephen)
Advisor(s)
Subra Suresh.
Date Issued
1996
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.
Includes bibliographical references (p. 84-87).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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http://dspace.mit.edu/handle/1721.1/7582
Persistent DSpace Link
http://hdl.handle.net/1721.1/41401
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