Wettability of low Sn solders on integrated circuit package metallizations
Name
10959189-MIT.pdf
Description
Full printable version
Size
2.72 MB
Format
Adobe PDF
Checksum (MD5)
ce2a18a53351b3e1040962e75104b7d4
Author(s)
Gabriel, Michelle Wendy
Advisor(s)
Nicholas J. Grant.
Date Issued
1983
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983.
MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE
Includes bibliographical references.
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
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