Three-dimensional, soft magnetic-cored solenoids via multi-material extrusion
Name
Three-dimensional soft magnetic-cored solenoids via multi-material extrusion.pdf
Size
5.12 MB
Format
Adobe PDF
Checksum (MD5)
5ada2d0f338aa24061b8e6b91104079e
Author(s)
Cañada, Jorge
Kim, Hyeonseok
Velásquez-García, Luis Fernando
Date Issued
February 20, 2024
Journal
Virtual and Physical Prototyping
Publisher
Taylor & Francis
Citation
Cañada, J., Kim, H., & Velásquez-García, L. F. (2024). Three-dimensional, soft magnetic-cored solenoids via multi-material extrusion. Virtual and Physical Prototyping, 19(1).
Version
Final published version
Abstract
This study reports fully 3D-printed, three-dimensional, soft magnetic-cored solenoids that generate three times the largest magnetic fields previously reported from 3D-printed solenoids. The devices are fabricated on a customised, multi-material 3D printer that can extrude both filaments and pellets. Three different kinds of materials are employed to manufacture the reported soft magnetic-cored solenoids: pure PLA (dielectric portions), PLA doped with copper particles (electrically conductive structures), and nylon or PLA doped with metallic particles (soft magnetic cores). Via manufacturing optimisation, the reported devices are 33% smaller and can withstand about twice the current, generating three times more magnetic field. The 3D-printed solenoids generate Gauss-level magnetic fields while drawing tens-of-milliamps currents and can be readily used to implement fully 3D-printed induction sensors. The results of this work extend the state of the art in 3D-printed electronics, enabling the creation of more complex and capable solenoids for in-situ manufactured and in-space manufactured electromagnetic systems.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Mechanical Engineering
Massachusetts Institute of Technology. Microsystems Technology Laboratories
Terms of Use
Creative Commons Attribution-Noncommercial
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1080/17452759.2024.2310046
