Effect of ligand on thermal dissipation from gold nanorods
Name
alper langmuir 2010.pdf
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main article
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767.71 KB
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Checksum (MD5)
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Author(s)
Alper, Joshua
Hamad-Schifferli, Kimberly
Date Issued
February 2010
Journal
Langmuir
Publisher
American Chemical Society
Citation
Alper, Joshua, and Kimberly Hamad-Schifferli. “Effect of Ligands on Thermal Dissipation from Gold Nanorods.” Langmuir 26.6 (2010) : 3786-3789.
Version
Author's final manuscript
Abstract
Thermal interface conductance was measured for soluble gold nanorods (NRs) coated with mercaptocarboxylic acids (HS-(CH[subscript 2])[subscript n]COOH, n = 5, 10, 15), thiolated polyethylene glycols (MW = 356, 1000, 5000), and HS-(CH[subscript2])[subscript 15]-COOH-coated NRs further coated with alternating layers of poly(diallyldimethylammonium chloride) and poly(sodium styrenesulfonate). Ferguson analysis determined ligand thickness. The thermal-diffusion-dominated regime of transient absorption spectra was fit to a continuum heat diffusion finite element model to obtain the thermal interface conductance, G, which varied with ligand chemistry but not molecule length. The results suggest that the ability to exclude water from the NR surface governs ligand G values.
MIT Department
Massachusetts Institute of Technology. Department of Biological Engineering
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1021/la904855s
