A liquid-shear-stress sensor using wafer-bonding technology
Name
25615925-MIT.pdf
Description
Full printable version
Size
7.73 MB
Format
Adobe PDF
Checksum (MD5)
a64a22cf65796d638890d2a6985b7623
Author(s)
Ng, Kay-Yip
Advisor(s)
Martin A. Schmidt.
Date Issued
1990
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.
Includes bibliographical references (leaves 131-135).
Subjects
Electrical Engineering and Computer Science
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
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