On-chip infrared sensors: redefining the benefits of scaling
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Hu_On-chip infrared.pdf
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Author(s)
Agarwal, Anu
Yadav, Anupama
Richardson, Kathleen
Luzinov, Igor
Kita, Derek M.
Lin, Hongtao
Gu, Tian
Hu, Juejun
Date Issued
May 2017
Journal
Proceedings of SPIE, Frontiers in Biological Detection: From Nanosensors to Systems IX
Publisher
SPIE
Citation
Kita, Derek et al. “On-Chip Infrared Sensors: Redefining the Benefits of Scaling.” Proceedings of SPIE, Frontiers in Biological Detection: From Nanosensors to Systems, January 28 - February 2 2017, San Francisco, California, USA, edited by Amos Danielli, et al., SPIE, May 2017 © 2017 SPIE
Version
Final published version
Abstract
Infrared (IR) spectroscopy is widely recognized as a gold standard technique for chemical and biological analysis. Traditional IR spectroscopy relies on fragile bench-top instruments located in dedicated laboratory settings, and is thus not suitable for emerging field-deployed applications such as in-line industrial process control, environmental monitoring, and point-of-care diagnosis. Recent strides in photonic integration technologies provide a promising route towards enabling miniaturized, rugged platforms for IR spectroscopic analysis. It is therefore attempting to simply replace the bulky discrete optical elements used in conventional IR spectroscopy with their on-chip counterparts. This size down-scaling approach, however, cripples the system performance as both the sensitivity of spectroscopic sensors and spectral resolution of spectrometers scale with optical path length. In light of this challenge, we will discuss two novel photonic device designs uniquely capable of reaping performance benefits from microphotonic scaling. We leverage strong optical and thermal confinement in judiciously designed micro-cavities to circumvent the thermal diffusion and optical diffraction limits in conventional photothermal sensors and achieve a record 104 photothermal sensitivity enhancement. In the second example, an on-chip spectrometer design with the Fellgett's advantage is analyzed. The design enables sub-nm spectral resolution on a millimeter-sized, fully packaged chip without moving parts.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1117/12.2250237
