Design and optimization of a light-emitting diode projection micro-stereolithography three-dimensional manufacturing system
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Fang_Design and optimization.pdf
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Author(s) • • • • • • • •
Lee, Howon
Fang, Nicholas Xuanlai
Zheng, Xiaoyu
Deotte, Joshua
Alonso, Matthew P.
Farquar, George R.
Weisgraber, Todd H.
Gemberling, Steven
Spadaccini, Christopher M.
Date Issued
December 2012
Journal
Review of Scientific Instruments
Publisher
American Institute of Physics (AIP)
Citation
Zheng, Xiaoyu et al. “Design and Optimization of a Light-emitting Diode Projection Micro-stereolithography Three-dimensional Manufacturing System.” Review of Scientific Instruments 83.12 (2012): 125001. ©2012 American Institute of Physics
Version
Final published version
Abstract
The rapid manufacture of complex three-dimensional micro-scale components has eluded researchers for decades. Several additive manufacturing options have been limited by either speed or the ability to fabricate true three-dimensional structures. Projection micro-stereolithography (PμSL) is a low cost, high throughput additive fabrication technique capable of generating three-dimensional microstructures in a bottom-up, layer by layer fashion. The PμSL system is reliable and capable of manufacturing a variety of highly complex, three-dimensional structures from micro- to meso-scales with micro-scale architecture and submicron precision. Our PμSL system utilizes a reconfigurable digital mask and a 395 nm light-emitting diode (LED) array to polymerize a liquid monomer in a layer-by-layer manufacturing process. This paper discusses the critical process parameters that influence polymerization depth and structure quality. Experimental characterization and performance of the LED-based PμSL system for fabricating highly complex three-dimensional structures for a large range of applications is presented.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1063/1.4769050