Repository logo
Log in(current)
Repository logoMIT Open ScholarshipDSpace@MIT
  1. Home
  2. MIT Open Access Articles
  3. MIT Open Access Articles
  4. Fabrication and characterization of thermally drawn fiber capacitors

Fabrication and characterization of thermally drawn fiber capacitors

Thumbnail Image
Download
Name

Lestoquoy-fabrication and characterization.pdf

Size

1.73 MB

Format

Adobe PDF

Checksum (MD5)

122a240eed0339c380ca3773760ec4c1

Author(s)
Lestoquoy, Guillaume
•
Wang, Zheng
•
Fink, Yoel
•
Chocat, Noemie
•
Joannopoulos, John
Date Issued
April 2013
Journal
Applied Physics Letters
Publisher
American Institute of Physics (AIP)
Citation
Lestoquoy, Guillaume, Noémie Chocat, Zheng Wang, John D. Joannopoulos, and Yoel Fink. “Fabrication and characterization of thermally drawn fiber capacitors.” Applied Physics Letters 102, no. 15 (2013): 152908. © 2013 AIP Publishing LLC
Version
Final published version
Abstract
We report on the fabrication of all-in-fiber capacitors with poly(vinylidene fluoride) (PVDF) as the dielectric material. Electrodes made of conductive polymer are separated by a PVDF thin film within a polycarbonate casing that is thermally drawn into multiple meters of light-weight, readily functional fiber. Capacitive response up to 20 kHz is measured and losses at higher-frequencies are accounted for in a materials-based model. A multilayered architecture in which a folded PVDF film separates interdigitated electrodes over an increased area is fabricated. This structure greatly enhances the capacitance, which scales linearly with the fiber length and is unaffected by fiber dimension fluctuations.
MIT Department
Massachusetts Institute of Technology. Institute for Soldier Nanotechnologies
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Massachusetts Institute of Technology. Department of Physics
Massachusetts Institute of Technology. Research Laboratory of Electronics
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
http://hdl.handle.net/1721.1/79812
DOI of Published Version
https://doi.org/10.1063/1.4802783
Repository logo
PrivacyPermissionsAccessibilityContact us
Repository logo
Notify us about copyright concerns.