Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink
Name
v002t08a027-ipack2013-73120.pdf
Size
1.39 MB
Format
Adobe PDF
Checksum (MD5)
5049d7f3b0eb29df7713be1f17b96cd9
Author(s)
Kariya, Harumichi Arthur
Hanks, Daniel Frank
Staats, Wayne Lawrence
Roche, Nicholas A
Cleary, Martin
Peters, Teresa B.
Brisson II, John G
Wang, Evelyn
Date Issued
July 2013
Journal
Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems; ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Publisher
ASME International
Citation
Kariya, H. Arthur, Daniel F. Hanks, Wayne L. Staats, Nicholas A. Roche, Martin Cleary, Teresa B. Peters, John G. Brisson, and Evelyn N. Wang. “Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink.” Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems (July 16, 2013), Burlingame, CA, USA, ASME International, 2018. © 2018 ASME International
Version
Final published version
Abstract
We present the characterization of a compact, high performance air-cooled heat sink with an integrated loop heat pipe. In this configuration, heat enters the heat sink at the evaporator base and is transferred within the heat pipe by the latent heat of vaporization of a working fluid. From the condensers, the heat is transferred to the ambient air by an integrated fan. Multiple condensers are used to increase the surface area available for air-cooling, and to ensure the equal and optimal operation of the individual condensers, an additional wick is incorporated into the condensers. We demonstrated with this design (10.2 cm × 10.2 cm × 9 cm), a total thermal resistance of less than 0.1 °C/W while dissipating a heat load of 500 W from a source at 75 °C. Furthermore, constant thermal resistance was observed in the upright as well as sideways orientations. This prototype is a proof-of-concept demonstration of a high performance and efficient air-cooled heat sink design that can be readily integrated for various electronics packaging and data center applications.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1115/IPACK2013-73120
