Active Thermal Control of Distributed Parameter Systems With Application to Testing of Packaged IC Devices
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Actvcntrl.pdf
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300.35 KB
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Author(s)
Sweetland, Matthew
Lienhard, John H
Date Issued
January 29, 2003
Journal
ASME Journal of Heat Transfer
Publisher
ASME International
Citation
Sweetland, M., and Lienhard, J. H., V (January 29, 2003). "Active Thermal Control of Distributed Parameter Systems With Application to Testing of Packaged IC Devices ." ASME. J. Heat Transfer. February 2003; 125(1): 164–174.
Version
Author's final manuscript
Abstract
Active control of the die-level temperature is desirable during production testing of high power microprocessors, so as to ensure accurate performance classification. Such control requires that the controlling thermal load time-lead the dissipated thermal load and that it be modulated to account for the distributed thermal capacitance and resistance of the device packaging. The analysis in this paper demonstrates fundamental limits of temperature control for typical devices under test conditions. These limits are identified for specified control power to die power ratios. The effects of test sequence design and device package design on the temperature control limits are also examined. The theory developed can be applied to any thermal control problem where a conductive medium separates the control source from the location where control is desired.
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1115/1.1527908
