MEMS Materials and Processes: a research overview
Name
AMMNS018.pdf
Size
976.71 KB
Format
Adobe PDF
Checksum (MD5)
fa798fa3c1f19422957a4e0f1efddf14
Author(s)
Spearing, S. Mark
Date Issued
January 2003
Series/Report no.
Advanced Materials for Micro- and Nano-Systems (AMMNS);
Abstract
An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybrid structures, modeling of wafer bonding processes and development of high temperature fluid interconnections. Emphasis is placed on the key areas of materials science and engineering.
Subjects
microelectromechanical systems
mechanical properties
process development
process modeling
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