220-to-330-GHz Manifold Triplexer With Wide Stopband Utilizing Ridged Substrate Integrated Waveguides
Name
2020_T-MTT_Jack_THz_Channelizer.pdf
Description
Accepted version
Size
2.87 MB
Format
Adobe PDF
Checksum (MD5)
52c12e5a92476007cb0398e8f72b97b5
Author(s)
Holloway, Jack W.
Han, Ruonan
Date Issued
August 2020
Journal
IEEE Transactions on Microwave Theory and Techniques
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Holloway, Jack W. et al. “220-to-330-GHz Manifold Triplexer With Wide Stopband Utilizing Ridged Substrate Integrated Waveguides.” IEEE Transactions on Microwave Theory and Techniques, 68, 8 (August 2020): 3428-3438 © 2020 The Author(s)
Version
Author's final manuscript
Abstract
This article reports a three-channel, noncontiguous, manifold multiplexer operating from 220 to 330 GHz, a 40% fractional operating bandwidth. The structure is designed and implemented using a set of ridged substrate integrated waveguides (SIWs). The ridged SIW improves the stopband bandwidth and reduces the overall structure size by 35% over a conventional SIW design. The triplexer utilizes an organic package substrate technology developed by Intel, featuring four thick copper metal layers and continuous trench vias in lieu of standard via fences, which significantly decrease the ohmic loss of the ridged SIW waveguides. Electromagnetic-circuit modeling and codesign techniques are adopted in the development of the triplexer structure. The fabricated triplexer is measured using banded millimeter-wave wafer probing and exhibits 37 dB of insertion loss in the passbands and better than 10 dB of average return loss for each of the channel filters. The measured stopband attenuation is better than 27 dB for all three channels.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/TMTT.2020.2997367
