Large-area and high-resolution distortion measurement based on moire fringe method for hot embossing process
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Boning-Large-area and high.pdf
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Author(s)
Boning, Duane S.
Taylor, Hayden Kingsley
Youcef-Toumi, Kamal
Xu, Zhiguang
Yoon, Soon Fatt
Date Issued
September 2009
Journal
Optics Express
Publisher
Optical Society of America
Citation
Xu, Zhiguang et al. “Large-area and High-resolution Distortion Measurement Based on Moiré Fringe Method for Hot Embossing Process.” Optics Express 17.21 (2009): 18394. © Copyright 2009 The Optical Society
Version
Final published version
Abstract
A moiré fringe approach is developed to identify simultaneously the global and local distortions in hot-embossed polymeric samples. A square grid pattern with a pitch of 63.5 μm is hot-embossed on the polymer substrate. When a reference grid, a polymeric film with the same pattern, is placed on top of the sample, a moiré fringe pattern is observed and recorded by a document scanner. The deviation of the intersections of the fringes from their ideal positions presents the residual distortion in the sample. With different sample-reference rotation angles eight images are acquired for the same sample to achieve the optimal result by a data fitting technique. The validity of this method is proved by the self-consistency of the results from the eight images. To the best of our knowledge, this is the first time distortion quantification has been achieved both in a large area up to that of a scanner and with a high resolution at the level of 1 μm. Furthermore, we do not use any expensive instrument, nor need to measure the sample–reference rotation angle or position the sample precisely, and the process is run automatically by a computer instead of manual operation.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1364/OE.17.018394
