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Integrated on Chip Platform with Quantum Emitters in Layered Materials

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sword-2020-12-14T17:22:22.original.xml (130 B)
Original SWORD entry document
Author(s)
Lu, Tsung-Ju
•
Englund, Dirk R.
Date Issued
September 2019
Journal
Advanced Optical Materials
Publisher
Wiley
Citation
Kim, Sejeong et al. “Integrated on Chip Platform with Quantum Emitters in Layered Materials.” Advanced Optical Materials, 7, 23 (September 2019): 1901132 © 2019 The Author(s)
Version
Original manuscript
Abstract
Integrated quantum photonic circuitry is an emerging topic that requires efficient coupling of quantum light sources to waveguides and optical resonators. So far, great effort is devoted to engineering on-chip systems from 3D crystals such as diamond or gallium arsenide. In this study, room-temperature coupling is demonstrated of quantum emitters embedded in layered hexagonal boron nitride to an on-chip aluminum nitride waveguide. 1.35% light coupling efficiency is achieved in the device and transmission of single photons through the waveguide is demonstrated. The results serve as foundation for integrating layered materials to on-chip components and realizing integrated quantum photonic circuitry.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
http://creativecommons.org/licenses/by-nc-sa/4.0/
Persistent DSpace Link
https://hdl.handle.net/1721.1/129633
DOI of Published Version
https://doi.org/10.1002/ADOM.201901132
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