Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects
Name
AMMNS003.pdf
Size
403.03 KB
Format
Adobe PDF
Checksum (MD5)
323c93d41aee8ecbc7e72e1adf392d49
Author(s)
Leong, Hoi Liong
Gan, C.L.
Pey, Kin Leong
Thompson, Carl V.
Li, Hongyu
Date Issued
January 2006
Series/Report no.
Advanced Materials for Micro- and Nano-Systems (AMMNS)
Abstract
Bonded copper interconnects were created using thermo-compression bonding and the dicing yield was used as an indication of the bond quality. SEM images indicated that the Cu was plastically deformed. Our experimental and modeling results indicate that the effective contact area is directly proportional to the applied load. Furthermore, for first time, results have been obtained that indicate that the dicing yield is proportional to the measured bond strength, and the bond strength is proportional to the effective contact area. It is also shown that films with rougher surfaces (and corresponding lower effective bonding areas) have lower bond strengths and dicing yields. A quantitative model for the relationship between measured surface roughness and the corresponding dicing yield has been developed. An appropriate surface-roughness data acquisition methodology has also been developed. The maximum possible applied load and the minimum possible surface roughness are required to obtain the maximum effective contact area, and hence to achieve optimum yields (both mechanically and electrically).
Subjects
Cu-Cu thermo-compression bonding
wafer-wafer bonding
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