Integrated photonic devices for spectroscopic chemical detection
Name
1155052640-MIT.pdf
Size
19.64 MB
Format
Adobe PDF
Checksum (MD5)
6a20a65b6b031c4104cf6470225d0431
Author(s)
Kita, Derek Matthew.
Advisor(s)
Juejun Hu and Lionel C. Kimerling.
Date Issued
2020
Publisher
Massachusetts Institute of Technology
Abstract
Chemical sensing systems realized with photonic components integrated on traditional semiconductor substrates have emerged as a promising technology for remote sensing applications that require low cost, low power consumption, light weight, small size, and high-performance. In this thesis, I discuss methods and systems for practical implementations of chip-scale integrated photonic chemical sensors and spectromeƯters. The work focuses on solutions to a variety of obstacles that have hindered real-world implementations of microphotonic chemical sensors. First, a new chip arƯchitecture capable of acquiring high channel count, high resolution optical spectra (200 pm resolution in the telecommunications C-band) is presented both theoretically and experimentally, along with a new 'elastic-D₁' regularized regression method for spectrum reconstruction. Next, evanescent field sensing using dielectric waveguides is studied theoretically and numerically, with a special emphasis on sensing perforƯmance in the presence of random, fabrication-induced waveguide sidewall roughness. I demonstrate that a locally flat perturbation approximation is valid for typical experƯimental roughness in silicon-on-insulator platforms, and use a volume-current method to explicitly compute scattering loss rates for a variety of three-dimensional wavegƯuide structures. To then experimentally realize photonic sensing systems, I developed a low-loss (0.36 ± 0.11 dB/cm), quick-turn (16.4 day turnaround) fabrication process for inexpensively prototyping silicon nitride photonic integrated circuits with heaters, etched edge couplers, and opened sensing windows. Using this fabrication process, I present a successful experimental demonstration of a fiber-packaged, waveguideƯenhanced Raman spectroscopic sensor used for detecting liquids in contact with the surface of the chip via measured Raman peaks from 500 - 3500 cm⁻¹.
Description
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Materials Science and Engineering, 2020
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 155-173).
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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