Design method of a modular electronic printed circuit board testing system
Name
871544352-MIT.pdf
Description
Full printable version
Size
12.1 MB
Format
Adobe PDF
Checksum (MD5)
e458aa58e59af16f89bf42288afba4ba
Author(s)
McCalib, David, Jr
Advisor(s)
Stanley B. Gershwin.
Date Issued
2013
Publisher
Massachusetts Institute of Technology
Abstract
The failure rate of the printed circuit board electronic testing process is higher than acceptable at a Lenze Americas factory. This thesis will understand the root causes of failure, and use system engineering methods to decide what course of action should be taken. A Tradespace analysis is used to help decompose some of the complexity into a visualization that simplifies the decision process. The Tradespace analysis suggests that more utility can be achieved by upgrading the design of existing test fixtures versus purchasing off of the shelf solutions. The second phase will identify a design concept, offer specific design solutions, and finally a fully designed system that is capable of improving the performance of the test fixtures in electronic board test area by 50%. The system is then upgradable with in-line conveyors to run autonomously decoupling the operator from the process.
Description
Thesis: M. Eng. in Manufacturing, Massachusetts Institute of Technology, Department of Mechanical Engineering, 2013.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 52-54).
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
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