Fabrication of a nanoporous membrane device for high heat flux evaporative cooling
Name
1005738566-MIT.pdf
Description
Full printable version
Size
11.49 MB
Format
Adobe PDF
Checksum (MD5)
1aed57496cca86b974fcdc225ebedd23
Author(s)
Sircar, Jay D
Advisor(s)
Evelyn N. Wang.
Date Issued
2017
Publisher
Massachusetts Institute of Technology
Abstract
We investigated the experimental performance of a nanoporous membrane for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that allow for lower viscous pressure losses. The 600 nm thick membrane was fabricated on a silicon on insulator (SOI) wafer, fusion-bonded to a separate wafer with larger liquid channels. Spreading effects and overall device performance arising from non-uniform heating and evaporation of methanol was captured experimentally. Heat fluxes up to 412 W/cm2, over an area of O.4x 5 mm, and with a temperature rise of 24.1 K from the heated substrate to ambient vapor, were obtained. These results are in good agreement with a high-fidelity, coupled fluid convection and solid conduction compact model, which was necessitated by computational feasibility, which incorporates non-equilibrium and sub-continuum effects at the liquid-vapor interface. This work provides a proof-of-concept demonstration of our biporous evaporation device. Simulations from the validated model, at optimized operating conditions and with improved working fluids, predict heat dissipation in excess of 1 kW/cm2 with a device temperature rise below 30 K, for this scalable cooling approach.
Description
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 60-63).
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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