Analysis of the thermal conductivity of epoxy and reaction bonded silicon nitride matrix particulate composites
Name
34791214-MIT.pdf
Description
Full printable version
Size
2.5 MB
Format
Adobe PDF
Checksum (MD5)
4e2dccdbf6b2e808ee12c4818d829611
Author(s)
Stephens, Clifford
Advisor(s)
Yet-Ming Chiang, John Haggerty.
Date Issued
1996
Publisher
Massachusetts Institute of Technology
Description
Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.
Includes bibliographical references (leaves 39-40).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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