Microscale thermal engineering of electronic systems
Name
GOODSON.pdf
Description
Main article
Size
316.36 KB
Format
Adobe PDF
Checksum (MD5)
523d8d7092e55287e1f4e28aac971875
Author(s)
Goodson, K.E.
Date Issued
May 2003
Abstract
The electronics industry is encountering thermal challenges
and opportunities with lengthscales comparable to or much less
than one micrometer. Examples include nanoscale phonon
hotspots in transistors and the increasing temperature rise in onchip
interconnects. Millimeter-scale hotspots on
microprocessors, resulting from varying rates of power
consumption, are being addressed using two-phase
microchannel heat sinks. Nanoscale thermal data storage
technology has received much attention recently. This paper
provides an overview of these topics with a focus on related
research at Stanford University.
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