Fabrication and Performance of Silicon-Embedded Permanent-Magnet Microgenerators
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Lang_Fabrication and performance.pdf
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Author(s)
Herrault, Florian
Yen, Bernard C.
Ji, Chang-Hyeon
Spakovszky, Zoltan S.
Lang, Jeffrey H.
Allen, Mark G.
Date Issued
February 2010
Journal
Journal of Microelectromechanical Systems
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Herrault, Florian et al. “Fabrication and Performance of Silicon-Embedded Permanent-Magnet Microgenerators.” Journal of Microelectromechanical Systems 19.1 (2010): 4–13. © Copyright 2010 IEEE
Version
Final published version
Abstract
This paper focuses on the design, fabrication, and characterization of silicon-packaged permanent-magnet (PM) microgenerators. The use of silicon packaging favors fine control on shape and dimensions in batch fabrication and provides a path toward high rotational speeds (1Mr/min), a requirement for ultimate compactness of microgenerators. The successful silicon packaging of these microgenerators consisted of three essential elements: (1) a winding scheme allowing both nonplanar fabrication and through-wafer interconnects; (2) laminations built into the silicon for enhanced electrical performance; and (3) a balancing scheme for the heavy PM rotor to ensure its maximum performance. The devices were fabricated using bonded silicon wafers, integrated magnetics, and an electroplated metal. The mechanical strength of the 12-mm-diameter silicon-packaged PM rotors was evaluated at high rotational speeds using an external spindle drive. Speeds up to 200000 r/min were achieved prior to a mechanical rotor failure. The generators were electrically characterized, and an output power in excess of 1 W across a resistive load of 0.32 ?? was measured at a maximum speed. A 225% power increase was also experimentally determined due to the addition of a laminated stator back iron.
MIT Department
Massachusetts Institute of Technology. Department of Aeronautics and Astronautics
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1109/jmems.2009.2036583
