Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Kornbluth, Yosef S; Parameswaran, Lalitha; Mathews, Richard; Racz, Livia M; Velásquez-García, Luis F

Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Name

Adv Materials Technologies - 2022 - Kornbluth - Fully 3D‐Printed Ultrathin Capacitors via Multi‐Material Microsputtering.pdf

Description

Published version

Size

1.87 MB

Format

Adobe PDF

Checksum (MD5)

3d3bea117c52753fba184e0a16d1a170

sword-2022-10-07T12:58:34.original.xml (130 B)

Original SWORD entry document

Author(s)

Kornbluth, Yosef S

•

Parameswaran, Lalitha

•

Mathews, Richard

•

Racz, Livia M

•

Velásquez-García, Luis F

Date Issued

2022

Journal

Advanced Materials Technologies

Publisher

Wiley

Citation

Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M and Velásquez-García, Luis F. 2022. "Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering." Advanced Materials Technologies, 7 (8).

Version

Final published version

MIT Department

Massachusetts Institute of Technology. Microsystems Technology Laboratories

Lincoln Laboratory

Massachusetts Institute of Technology. Department of Mechanical Engineering

Terms of Use

Creative Commons Attribution 4.0 International license

https://creativecommons.org/licenses/by/4.0/

Persistent DSpace Link

https://hdl.handle.net/1721.1/145738

DOI of Published Version

https://doi.org/10.1002/ADMT.202200097