Development of pick-and-place assembly techniques for monolithic optopill integration
Name
60679424-MIT.pdf
Description
Full printable version
Size
9.54 MB
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Checksum (MD5)
a4a5677ab54def3c878544d870abe082
Author(s)
Teo, Mindy Simin, 1981-
Advisor(s)
Clifton G. Fonstad, Jr.
Date Issued
2005
Publisher
Massachusetts Institute of Technology
Abstract
The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.
Includes bibliographical references (p. 99-101).
Subjects
Electrical Engineering and Computer Science.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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