Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed Cmos Electronics
Name
Kong_Fully integrated.pdf
Size
772.5 KB
Format
Adobe PDF
Checksum (MD5)
079ea483bcf94240691fb089371e163b
Author(s)
Chen, Xiangyu
Akinwande, Deji
Lee, Kyeong-Jae
Close, Gael F.
Yasuda, Shinichi
Paul, Bipul C.
Fujita, Shinobu
Kong, Jing
Wong, H. -S. Philip
Date Issued
September 2010
Journal
IEEE Transactions on Electron Devices
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Chen, Xiangyu et al. “Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed CMOS Electronics.” IEEE Transactions on Electron Devices 57.11 (2010): 3137–3143. © Copyright 2010 IEEE
Version
Final published version
Abstract
Carbon-based nanomaterials such as metallic single-walled carbon nanotubes, multiwalled carbon nanotubes (MWCNTs), and graphene have been considered as some of the most promising candidates for future interconnect technology because of their high current-carrying capacity and conductivity in the nanoscale, and immunity to electromigration, which has been a great challenge for scaling down the traditional copper interconnects. Therefore, studies on the performance and optimization of carbon-based interconnects working in a realistic operational environment are needed in order to advance the technology beyond the exploratory discovery phase. In this paper, we present the first demonstration of graphene interconnects monolithically integrated with industry-standard complementary metal-oxide-semiconductor technology, as well as the first experimental results that compare the performance of high-speed on-chip graphene and MWCNT interconnects. The graphene interconnects operate up to 1.3-GHz frequency, which is a speed that is commensurate with the fastest high-speed processor chips today. A low-swing signaling technique has been applied to improve the speed of carbon interconnects up to 30%.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/TED.2010.2069562
