Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings
Name
Schuh_Residual stress.pdf
Size
472.24 KB
Format
Adobe PDF
Checksum (MD5)
cccad35d56c225801128aedeb505421a
Author(s)
Ziebell, Tiffany D.
Schuh, Christopher A.
Date Issued
March 2012
Journal
Journal of Materials Research
Publisher
Cambridge University Press (Materials Research Society)
Citation
Ziebell, Tiffany D., and Christopher A. Schuh. “Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings.” Journal of Materials Research 27, no. 09 (May 13, 2012): 1271-1284. © Materials Research Society 2012
Version
Final published version
Abstract
Characterizing the residual stress of thick nanocrystalline electrodeposits poses several unique challenges due to their fine grain structure, thickness distribution, and matte surface. We use a three-dimensional profilometry-based approach that addresses each of these complicating factors and enables quantitative analysis of residual stress with reasonable accuracy. The specific emphasis of this work is on thick (10–100 μm), nanocrystalline Ni-W electrodeposits of the finest grain sizes (4–63 nm), in which residual stresses arise during the deposition process as well as during postdeposition annealing. The present measurements offer quantitative insight into the mechanisms of stress development and evolution in these alloys, suggesting that the grain boundary structure is out of equilibrium (unrelaxed) and contains the excess free volume that controls the resulting residual stress levels in these films. There are apparently two factors contributing to this stress: the percentage of excess free volume contained in the grain boundaries, which is affected by the processing conditions, and the total volume fraction of grain boundaries, which is controlled by the grain size.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1557/jmr.2012.51
