Cryogenic Memory Architecture Integrating Spin Hall Effect based Magnetic Memory and Superconductive Cryotron Devices
Name
s41598-019-57137-9.pdf
Description
Published version
Size
2.89 MB
Format
Adobe PDF
Checksum (MD5)
32fc8fa9772ac1780f0827f64314da19
Author(s) • • • • • • • • •
Nguyen, Minh-Hai
Ribeill, Guilhem J
Gustafsson, Martin V
Shi, Shengjie
Aradhya, Sriharsha V
Wagner, Andrew P
Ranzani, Leonardo M
Zhu, Lijun
Baghdadi, Reza
Butters, Brenden
Date Issued
2020
Journal
Scientific Reports
Publisher
Springer Science and Business Media LLC
Version
Final published version
Abstract
© 2020, The Author(s). One of the most challenging obstacles to realizing exascale computing is minimizing the energy consumption of L2 cache, main memory, and interconnects to that memory. For promising cryogenic computing schemes utilizing Josephson junction superconducting logic, this obstacle is exacerbated by the cryogenic system requirements that expose the technology’s lack of high-density, high-speed and power-efficient memory. Here we demonstrate an array of cryogenic memory cells consisting of a non-volatile three-terminal magnetic tunnel junction element driven by the spin Hall effect, combined with a superconducting heater-cryotron bit-select element. The write energy of these memory elements is roughly 8 pJ with a bit-select element, designed to achieve a minimum overhead power consumption of about 30%. Individual magnetic memory cells measured at 4 K show reliable switching with write error rates below 10−6, and a 4 × 4 array can be fully addressed with bit select error rates of 10−6. This demonstration is a first step towards a full cryogenic memory architecture targeting energy and performance specifications appropriate for applications in superconducting high performance and quantum computing control systems, which require significant memory resources operating at 4 K.
MIT Department
Massachusetts Institute of Technology. Research Laboratory of Electronics
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Creative Commons Attribution 4.0 International license
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1038/S41598-019-57137-9