Repository logo
Log in(current)
Repository logoMIT Open ScholarshipDSpace@MIT
  1. Home
  2. MIT Libraries
  3. MIT Theses
  4. Undergraduate Theses
  5. Triple junctions and low angle boundaries

Triple junctions and low angle boundaries

Thumbnail Image
Download
Name

71227327-MIT.pdf

Description
Full printable version
Size

1021.33 KB

Format

Adobe PDF

Checksum (MD5)

4dd1f85d2656d5e45780483355f147cd

Author(s)
Rodrigues, Vinay
Advisor(s)
Christopher A. Schuh.
Date Issued
2006
Publisher
Massachusetts Institute of Technology
Abstract
Certain properties, such as cracking or corrosion, can occur mainly along grain boundaries. Certain types of boundaries may be more beneficial for material properties. The way that the boundaries are connected in a material can determine how boundaries will affect properties, for instance, whether or not crack resistant boundaries will arrest the growth of a crack. Boundaries in a polycrystalline material connect together at triple junctions. In this paper, we examine how the distribution of low angle boundaries at triple junctions varies with the texture of a material.
Description
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.
Includes bibliographical references (leaf 21).
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Persistent DSpace Link
http://hdl.handle.net/1721.1/35057
Repository logo
PrivacyPermissionsAccessibilityContact us
Repository logo
Notify us about copyright concerns.