Electrical bioadhesive interface for bioelectronics
Name
137.pdf
Description
Accepted version
Size
9.84 MB
Format
Unknown
Checksum (MD5)
699ef26840854472eb1c927081387593
Author(s)
Deng, Jue
Yuk, Hyunwoo
Wu, Jingjing
Varela, Claudia Elena
Chen, Xiaoyu
Roche, Ellen
Guo, Chuan Fei
Zhao, Xuanhe
Date Issued
2021
Journal
Nature Materials
Publisher
Springer Science and Business Media LLC
Citation
Deng, Jue, Yuk, Hyunwoo, Wu, Jingjing, Varela, Claudia E, Chen, Xiaoyu et al. 2021. "Electrical bioadhesive interface for bioelectronics." Nature Materials, 20 (2).
Version
Author's final manuscript
Abstract
© 2020, The Author(s), under exclusive licence to Springer Nature Limited. Reliable functions of bioelectronic devices require conformal, stable and conductive interfaces with biological tissues. Integrating bioelectronic devices with tissues usually relies on physical attachment or surgical suturing; however, these methods face challenges such as non-conformal contact, unstable fixation, tissue damage, and/or scar formation. Here, we report an electrical bioadhesive (e-bioadhesive) interface, based on a thin layer of a graphene nanocomposite, that can provide rapid (adhesion formation within 5 s), robust (interfacial toughness >400 J m−2) and on-demand detachable integration of bioelectronic devices on diverse wet dynamic tissues. The electrical conductivity (>2.6 S m−1) of the e-bioadhesive interface further allows bidirectional bioelectronic communications. We demonstrate biocompatibility, applicability, mechanical and electrical stability, and recording and stimulation functionalities of the e-bioadhesive interface based on ex vivo porcine and in vivo rat models. These findings offer a promising strategy to improve tissue–device integration and enhance the performance of biointegrated electronic devices.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Massachusetts Institute of Technology. Institute for Medical Engineering & Science
Harvard University--MIT Division of Health Sciences and Technology
Massachusetts Institute of Technology. Department of Civil and Environmental Engineering
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1038/S41563-020-00814-2
