Reversible concentric ring microfluidic interconnects
Name
153274626-MIT.pdf
Description
Full printable version
Size
17.95 MB
Format
Adobe PDF
Checksum (MD5)
ae20c7bbfce0224a0e787e626a7a2292
Author(s)
Thompson, Mary Kathryn, 1980-
Advisor(s)
Alexander H. Slocum.
Date Issued
2004
Publisher
Massachusetts Institute of Technology
Abstract
A reversible, Chip-to-Chip microfluidic interconnect was designed for use in high temperature, high pressure applications such as chemical microreactor systems. The interconnect uses two sets of concentric, interlocking rings with trapezoidal cross sections to form a fluid seal without the use of gaskets or sealants. Results from analytical and finite element models indicate good sealing capability. Macro scale devices show that the interconnects function as designed and seal up to 80 psi. Micro scale devices have been fabricated, engage as designed and are much stronger than anticipated, however pressure tests have not yet been conducted.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.
Includes bibliographical references.
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
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