Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating
Name
micromachines-09-00436.pdf
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3.71 MB
Format
Adobe PDF
Checksum (MD5)
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Author(s)
Kopell, Nancy
Scholvin, Jorg
Zorzos, Anthony Nicholas
Kinney, Justin
Bernstein, Jacob G
Moore-Kochlacs, Caroline
Fonstad Jr, Clifton G
Boyden, Edward
Date Issued
August 2018
Journal
Micromachines
Publisher
Multidisciplinary Digital Publishing Institute
Citation
Scholvin, Jörg et al. "Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating." Micromachines 9, 9 (August 2018): 436 © 2018 The Authors
Version
Final published version
Abstract
We devised a scalable, modular strategy for microfabricated 3-D neural probe synthesis. We constructed a 3-D probe out of individual 2-D components (arrays of shanks bearing close-packed electrodes) using mechanical self-locking and self-aligning techniques, followed by electroless nickel plating to establish electrical contact between the individual parts. We detail the fabrication and assembly process and demonstrate different 3-D probe designs bearing thousands of electrode sites. We find typical self-alignment accuracy between shanks of <0.2° and demonstrate orthogonal electrical connections of 40 µm pitch, with thousands of connections formed electrochemically in parallel. The fabrication methods introduced allow the design of scalable, modular electrodes for high-density 3-D neural recording. The combination of scalable 3-D design and close-packed recording sites may support a variety of large-scale neural recording strategies for the mammalian brain.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Media Laboratory
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Creative Commons Attribution
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DOI of Published Version
https://doi.org/10.3390/mi9090436
