Microscale Metal Additive Manufacturing by Solid‐State Impact Bonding of Shaped Thin Films
Name
Small - 2025 - Reiser - Microscale Metal Additive Manufacturing by Solid‐State Impact Bonding of Shaped Thin Films.pdf
Description
Published version
Size
3.2 MB
Format
Adobe PDF
Checksum (MD5)
bc6ae0f1df17822807feaae4879e7ef5
Author(s)
Reiser, Alain
Schuh, Christopher A
Date Issued
July 14, 2025
Journal
Small
Publisher
Wiley
Citation
A. Reiser and C. A. Schuh, “ Microscale Metal Additive Manufacturing by Solid-State Impact Bonding of Shaped Thin Films.” Small 21, no. 36 (2025): 21, 2503014.
Version
Final published version
Abstract
The deposition of device-grade inorganic materials is one key challenge towardthe implementation of additive manufacturing (AM) in microfabrication, andto that end, a broad range of physico-chemical principles has been exploredfor 3D fabrication with micro- and nanoscale resolution. Yet, for metals,a process that achieves material quality rivalling that of established thin-filmdeposition methods, and at the same time, has the potential to combinehigh throughput production with a broad palette of processable materials, isstill lacking. Here, the kinetic, solid-state bonding of metal thin films for theadditive assembly of high-purity, high-density metals with micrometer-scaleprecision is introduced. Indirect laser ablation accelerates micrometer-thickgold films to hundreds of meters per second without their heating or ablation.Their subsequent impact on the substrate above a critical velocity forms apermanent, metallic bond in the solid state. Stacked layers are of high density(>99%). By defining thin-film layers with established lithographic methodsprior to launch, a variable feature size (2–50 µm), arbitrary shape of bondedlayers, and parallel transfer of up to 36 independent film units in a single shot,is demonstrated. Thus, the solid-state kinetic bonding principle as a viableand potentially versatile route for micro-scale AM of metals is established.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
Creative Commons Attribution
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1002/smll.202503014
