PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices
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Demaine_PCB origami.pdf
Size
60.33 KB
Format
Adobe PDF
Checksum (MD5)
beb6477d80c1a8e0f1e6fcc28426a3ad
Author(s)
Sterman, Yoav
Oxman, Neri
Demaine, Erik D
Date Issued
October 2013
Journal
Journal of Mechanical Design
Publisher
ASME International
Citation
Sterman, Yoav, Erik D. Demaine, and Neri Oxman. “PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices.” Journal of Mechanical Design 135, no. 11 (October 8, 2013): 114502.
Version
Author's final manuscript
Abstract
Origami is traditionally implemented in paper, which is a passive material. This research explores the use of material with embedded electronics such as printed circuit boards (PCB) as the medium for origami folding to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays, it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as light emitting diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process.
MIT Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Media Laboratory
Program in Media Arts and Sciences (Massachusetts Institute of Technology)
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1115/1.4025370
