A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
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Author(s)
Sweetland, Matthew
Lienhard, John H
Slocum, Alexander
H.
Date Issued
August 12, 2008
Journal
ASME Journal of Electronic Packaging
Publisher
ASME International
Citation
Sweetland, M., Lienhard, J. H., V, and Slocum, A. (August 12, 2008). "A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing." ASME. J. Electron. Packag. September 2008; 130(3): 031012.
Version
Author's final manuscript
Abstract
Active control of die-level temperature is required during production testing of high power microprocessors in order to ensure accurate performance classification, but control is becoming more difficult as the device power densities increase. With power densities approaching 100 W/cm2, the current passive control systems are no longer able to maintain the required temperature tolerance for production testing. This paper describes the design and testing of a temperature control system that combines high performance impingement cooling with higher power laser heating with application to packaged integrated circuit devices under dynamic testing conditions. Also presented are system design concepts and experimental results for typical microprocessor thermal test vehicles.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1115/1.2966437
