Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C
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2023019047.pdf
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Author(s)
Xie, Qingyun
Yuan, Mengyang
Niroula, John
Sikder, Bejoy
Luo, Shisong
Fu, Kai
Rajput, Nitul S.
Pranta, Ayan Biswas
Yadav, Pradyot
Zhao, Yuji
Date Issued
June 11, 2023
Publisher
IEEE
Citation
Xie, Qingyun, Yuan, Mengyang, Niroula, John, Sikder, Bejoy, Luo, Shisong et al. 2023. "Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C." 2023 IEEE Symposium on VLSI Technology and Circuits.
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Author's final manuscript
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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DOI of Published Version
https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185364
