Framework for characterization of copper interconnect in damascene CMP processes
Name
40458672-MIT.pdf
Description
Full printable version
Size
39.06 MB
Format
Adobe PDF
Checksum (MD5)
35f699cbc34065b07ca55f9c51843ac2
Author(s)
Park, Tae Hong, 1973-
Advisor(s)
Duane Boning and James Chung.
Alternative Title
Characterization and modeling of pattern dependent variation in copper damascene CMP processes
Date Issued
1998
Publisher
Massachusetts Institute of Technology
Description
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; and, Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.
Includes bibliographical references (leaves 73-75).
Subjects
Electrical Engineering and Computer Science
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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reproduction or distribution in any format is prohibited without written
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