Substrate-blind photonic integration based on high-index glass materials
Name
Hu_Substrate-blind.pdf
Size
4.73 MB
Format
Adobe PDF
Checksum (MD5)
72ad3f088497dacdcd1ef2094431ea2d
Author(s)
Lin, Hongtao
Li, Lan
Zou, Yi
Du, Qingyang
Ogbuu, Okechukwu
Smith, Charmayne
Koontz, Erick
Musgraves, David
Richardson, Kathleen
Hu, Juejun
Date Issued
November 2014
Journal
Proceedings of SPIE--the Society of Photo-Optical Instrumentation Engineers
Publisher
SPIE
Citation
Lin, Hongtao et al. “Substrate-Blind Photonic Integration Based on High-Index Glass Materials.” Proceedings of SPIE, Nanophotonics and Micro/Nano Optics II, October 2014, Beijing, China, edited by Zhiping Zhou and Kazumi Wada, SPIE, November 2014. © 2014 SPIE
Version
Final published version
Abstract
Conventional photonic integration technologies are inevitably substrate-dependent, as different substrate platforms stipulate vastly different device fabrication methods and processing compatibility requirements. Here we capitalize on the unique monolithic integration capacity of composition-engineered non-silicate glass materials (amorphous chalcogenides and transition metal oxides) to enable multifunctional, multi-layer photonic integration on virtually any technically important substrate platforms. We show that high-index glass film deposition and device fabrication can be performed at low temperatures ( < 250 °C) without compromising their low loss characteristics, and is thus fully compatible with monolithic integration on a broad range of substrates including semiconductors, plastics, textiles, and metals. Application of the technology is highlighted through three examples: demonstration of high-performance mid-IR photonic sensors on fluoride crystals, direct fabrication of photonic structures on graphene, and 3-D photonic integration on flexible plastic substrates.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1117/12.2073972
