Carbon nanotube interconnects for IC chips
Name
104699663-MIT.pdf
Description
Full printable version
Size
4.84 MB
Format
Adobe PDF
Checksum (MD5)
b770b62d9f8a9b2d231dcbdbdef60947
Author(s)
Anwar Ali, Hashina Parveen
Advisor(s)
Carl V. Thompson.
Alternative Title
CNT interconnects for Integrated Chip chips
Date Issued
2006
Publisher
Massachusetts Institute of Technology
Abstract
Carbon nanotubes (CNTs) have been investigated as candidate materials to replace or augment the existing copper-based technologies as interconnects for Integrated Circuit (IC) chips. Being ballistic conductors, CNTs are capable of carrying higher current densities of up to 10¹⁰A/cm² and high thermal conductivity. This thesis examines the technological aspect of carbon nanotubes - how these tubes can excel in place of copper in terms of their performance and integration into the current commercial IC chip process. A detailed literature review is covered, together with a performance analysis of the resistances between copper and CNT interconnects. Further, a business model is proposed on the possibility of introducing this technology into the mainstream IC industry.
Description
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.
Includes bibliographical references (leaves 93-94).
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
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