Airblue: A System for Cross-Layer Wireless Protocol Development
Name
Arvind-Airblue.pdf
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1.59 MB
Format
Adobe PDF
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Author(s) • • • • •
Ng, Man Cheuk
Fleming, Kermin Elliott
Vutukuru, Mythili
Gross, Samuel
Mithal, Arvind
Balakrishnan, Hari
Date Issued
October 2010
Journal
ACM/IEEE Symposium on Architectures for Networking and Communications Systems (ANCS), 2010
Publisher
Institute of Electrical and Electronics Engineers
Citation
Ng, Man Cheuk et al. "Airblue: A System for Cross-Layer Wireless Protocol Development." in Proceedings of the ACM/IEEE Symposium on Architectures for Networking and Communications Systems (ANCS), 2010, 25-26 Oct., La Jolla, Calif.
Version
Final published version
Abstract
Over the past few years, researchers have developed many crosslayer wireless protocols to improve the performance of wireless networks. Experimental evaluations of these protocols have been carried out mostly using software-defined radios, which are typically two to three orders of magnitude slower than commodity hardware. FPGA-based platforms provide much better speeds but are quite difficult to modify because of the way high-speed designs are typically implemented. Experimenting with cross-layer protocols requires a flexible way to convey information beyond the data itself from lower to higher layers, and a way for higher layers to configure lower layers dynamically and within some latency bounds. One also needs to be able to modify a layer's processing pipeline without triggering a cascade of changes. We have developed Airblue, an FPGA-based software radio platform, that has all these properties and runs at speeds comparable to commodity hardware. We discuss the design philosophy underlying Airblue that makes it relatively easy to modify it, and present early experimental results.
MIT Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5623848