Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion
Name
4795604.pdf
Description
Published version
Size
3.31 MB
Format
Adobe PDF
Checksum (MD5)
f61b5520bc48071ac2c0264d86fe3538
Author(s)
Du, H.
Fang, N. X.
Date Issued
December 2018
Journal
Research
Publisher
American Association for the Advancement of Science (AAAS)
Citation
Wu, L. et al. “Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion.” Research 2018 (2018): Article 4795604 © 2018 The Author(s)
Version
Final published version
Abstract
Additive manufacturing based on liquid resin curing is one of the most promising methods to construct delicate structures. However, precision and speed are limited by the vertical adhesion of in situ cured resin at the curing interface. To overcome the unavoidable adhesion and to develop a general curing interface, we propose a slippery surface taking inspiration of the peristome surface of the pitcher plant. Such surface shows ultra-low adhesive energy at the curing interface due to the inhibition of the direct contact between the cured resin and the solid surface, which also increases the refilling speed of liquid resin. This ultra-low adhesive energy interface is effective for continuous 3D printing and provides insights into the physical mechanisms in reducing vertical solid-solid interfacial adhesion.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Creative Commons Attribution 4.0 International license
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1155/2018/4795604
