On the charging and thermal characterization of a micro/nano structured thermal ground plane
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Varanasi_On the charging.pdf
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426.27 KB
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Checksum (MD5)
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Author(s)
de Bock, H. Peter J.
Chauhan, Shakti
Chamarthy, Pramod
Weaver, Stanton E.
Deng, Tao
Gerner, Frank M.
Ababneh, Mohammed T.
Varanasi, Kripa K.
Date Issued
July 2010
Journal
Proceedings of the 12th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
de Bock, H. Peter J. et al. “On the Charging and Thermal Characterization of a Micro/nano Structured Thermal Ground Plane.” 12th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010. 1–6. © Copyright 2010 IEEE
Version
Final published version
Abstract
As power densities in electronic devices have increased dramatically over the last decade, advanced thermal management solutions are required. A significant part of the thermal resistance budget is commonly taken up by the heat spreader, which serves to reduce the input heat flux and connect to an increased area for heat removal. Thermal ground planes are devices that address this issue by utilizing two-phase heat transfer achieving higher effective thermal conductivities than conventional solid heat spreaders. This study describes the need for and design of a charging station to accurately dispense the working fluid and a thermal characterization experiment to characterize performance. The design study includes detailed analysis of accuracy and validation of the setup.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/ITHERM.2010.5501325
